China's central bank announced plans to launch a new 'sci-tech board' within its bond market, aimed at facilitating the issuance of sci-tech innovation bonds. This initiative will support financial institutions, technology companies, and private equity investment firms in raising capital for innovation, project financing, and mergers and acquisitions. The governor of the People's Bank of China, Pan Gongsheng, highlighted that the new bond platform will also expand a tech industry re-lending program to approximately $138 billion. This move is part of China's broader strategy to bolster its technology sector and enhance financing options for tech firms.