Eliyan, a company specializing in chiplet interconnect technology, has successfully raised $60 million in a Series B funding round. The funding aims to advance its technology that enhances the performance of AI chips. The round was co-led by Samsung Catalyst Fund and Tiger Global, with Intel ($INTC) and Micron ($MU) participating in the first round. Eliyan's technology, which includes the Blackwell NVLink 5.0, achieves 64 Gb/s per bump on a 3nm process and offers die connectivity without the need for a silicon interposer. Currently, it provides 40 Gb/s per bump, competing with TSMC's offerings. Additionally, the company's NuLink PHY technology allows for up to 21 Tb/s per mm with advanced packaging.