Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly planning to increase prices for its 3nm manufacturing and CoWoS advanced packaging starting in 2024. The price for 3nm chips is expected to rise by over 5%, while the cost of CoWoS advanced packaging will increase by 10%-20%. This decision comes amid a capacity shortage that is anticipated to last through 2026. Major tech companies, including Nvidia, Qualcomm, AMD, Intel, Apple, MediaTek, and Google, are vying for TSMC’s 3nm capacity. The demand for AI accelerators, smartphones, and data centers is driving the strong orders. TSMC also plans to double its CoWoS capacity to 33,000 wafers per month in Q3 from 17,000 in Q2. Additionally, the company aims to double its 3nm capacity.