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Broadcom has introduced its groundbreaking 3.5D Face-To-Face Technology through the XDSiP platform, designed to enhance custom chip performance amid increasing demand for generative AI solutions. This innovative technology integrates over 6000mm² of silicon and 12 High Bandwidth Memory (HBM) stacks, enabling high-efficiency AI XPU solutions at scale. The announcement comes at a time when Broadcom is preparing for its upcoming earnings report scheduled for December 12, 2024, as the company continues to position itself as a leader in the semiconductor industry, particularly in the AI sector.
Key Earnings Reports on Monday Before the Open: None After the Close: C3․ai $AI Casey's General $CASY MongoDB $MDB Oracle $ORCL Toll Brothers $TOL Vail Resorts $MTN For more details, start a trial at https://t.co/H4p1RcpfIn.
Busy-ish week looming ahead. CPI and PPI reports. Is inflation still cooling? Plus the weekly jobless claims figures. On the earnings front, results due out from $ORCL $TOL $AI $AZO $GME $OLLI $ASO $PLAY $ADBE $AVGO $COST $CIEN
$AVGO back through its 50-day. Earnings coming up on 12/12. @marketsurge @IBDinvestors #IBDPartner https://t.co/eqAHFpIuRN https://t.co/QIA9WoClv6
