Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) is accelerating its global expansion in 2025 by planning to build or ramp up nine new production facilities, including six semiconductor fabs and one advanced packaging plant in Taiwan, and two fabs overseas. The company’s 3nm chip capacity is expected to grow by over 60% this year to meet strong demand from major clients such as Apple, Qualcomm, Nvidia, and AMD, driven by AI and high-performance computing needs. TSMC’s 2nm process is projected to achieve full capacity by the fourth quarter, breaking historical records, while the 3nm node has already reached full utilization faster than any previous node. TSMC also reported a 48% increase in April sales, signaling robust demand and anticipating continued growth in the coming periods. Meanwhile, TSS Inc. (TSSI) reported a record quarter with $99 million in revenue, marking a 523% year-over-year increase, driven by AI data center integration and new facility expansion. The company’s diluted earnings per share rose to $0.12, and adjusted EBITDA grew more than tenfold to $5.2 million. Management projects over 50% year-over-year growth in adjusted EBITDA, positioning TSS as a leader in tech infrastructure for AI applications.