Jul 18, 01:25 PM

US Launches $1.6B Chip Packaging R&D Competition, UT Austin Receives $840M, DARPA for Department of Defense

The US launches a $1.6 billion funding competition for chip packaging R&D, covering various aspects. UT Austin receives $840 million for semiconductor research, matched by $615 million from Texas, totaling $1.455 billion. DARPA selects Texas Institute for Electronics at UT Austin for an $840 million program to develop high-performing semiconductor microsystems for the Department of Defense.

#US #UT Austin #Texas #DARPA #Department of Defense

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