.@Intel has partnered with @SoftBank to build a power-efficient stacked DRAM substitute for #HBM Viable demos in 2027, commercialization before 2030 https://t.co/QarambzbhM #AI #HPC

Ray Wang@rwang07

3 months ago

NVIDIA is partnering with Samsung, SK Hynix, and Micron to co‑develop a new memory‑module standard called SOCAMM that promises a smaller footprint and higher performance. Nice flag by my man @QQ_Timmy 👇 Reports indicate that NVIDIA and the memory vendors are already swapping https://t.co/nvQSUgUsrJ

駿HaYaO@QQ_Timmy

3 months ago

輝達 (NVDA-US) 正聯合全球三大記憶體晶片製造商三星 (5007-TW) 、SK 海力士與美光 (MICR-US) ，共同研發一項全新記憶體模組標準 SOCAMM（System On Chip Advanced Memory Module），主打小體積、高效能。 根據報導，目前輝達和記憶體公司目前正在交換 SOCAMM