India's Union Cabinet has approved four new semiconductor manufacturing projects with a combined investment of approximately 4,594 crore rupees (around 45.94 billion rupees) under the India Semiconductor Mission. These projects are set to be established in the states of Odisha, Punjab, and Andhra Pradesh. This approval brings the total number of semiconductor projects under the mission to ten, following six previously approved units. The new plants are expected to commence construction soon and will focus on advanced packaging and compound semiconductor fabs, including Silicon Carbide (SiC) technology. Union Minister Ashwini Vaishnaw highlighted the government's commitment to boosting domestic chip production as part of the Make in India initiative. Odisha will host two of these projects, with companies such as SicSem Private Ltd and 3D Glass Solutions Inc involved. State officials expressed support for the developments, emphasizing the potential for job creation and skill development in the semiconductor sector. Prime Minister Narendra Modi noted that these steps are part of India's rapid progress in building a robust semiconductor ecosystem to power its digital future and drive global innovation.