India's Union Cabinet has approved four new semiconductor manufacturing projects with a total investment of approximately 4,594 crore rupees (around $560 million) across the states of Odisha, Punjab, and Andhra Pradesh. This decision expands the India Semiconductor Mission's portfolio to ten projects, building on six previously approved plants. The projects include units by SicSem Private Ltd and 3D Glass Solutions Inc in Odisha, with construction expected to commence soon. The initiative is part of the government's broader 'Make in India' campaign to develop a robust semiconductor ecosystem, enhance domestic chip production, and boost the country's digital future and global innovation capacity. Odisha's government is actively preparing workforce training programs to support these developments. The move follows a surge in India's electronics manufacturing sector, which saw exports rise 47% in the first quarter of fiscal year 2026 to $12.4 billion, with mobile phone production increasing significantly over the past decade. Additionally, Cyient has launched a $100 million semiconductor division focused on designing power-efficient ASICs for automotive, data center, medical, aerospace, and defense applications, further signaling India's growing ambitions in chip design and manufacturing.