China is pressing the United States to ease export controls on high-bandwidth memory (HBM) chips, which are critical for artificial intelligence (AI) processing, as part of ongoing trade negotiations. This request comes ahead of a potential summit between U.S. President Donald Trump and Chinese President Xi Jinping. The easing of restrictions on these chips, including those used by companies such as Huawei and Semiconductor Manufacturing International Corporation (SMIC), is seen as a key condition for a broader trade deal. Both countries have extended their tariff truce beyond August 12, 2025, as talks continue. The Financial Times and Reuters have reported on China's demands, highlighting concerns from some U.S. officials that Trump might loosen export controls to secure the summit. The focus on HBM chips reflects their importance in advancing AI technology, and China views the current export curbs as a constraint on its technological development.